AP-300

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- 300mm Wafer Polishing, Oxide, Metal

Process Performance
- High performance CMP process
- Advanced carrier with 5 zone pressure control
- All available 300mm CMP process
- In-situ and ex-situ pad conditioning(13zone)
- Carrier linear oscillation.
- H.P rinse › dual type spray nozzle
Hardware Performance
- Spindle rotation control » DDR motor
- Trend data review
- Temp, motor torque
- CIP pad conditioner
- Calibration Table